2、Wide bonding range, high bonding strength, high temperature impact resistance.
Performance before curing | ||||
Appearance | Paste/red-colored | |||
Composition | Epoxy resin | |||
Specific gravity(25℃) | 1.25 | ASTM D792 | ||
Viscosity(cp 25℃) | 1500000 | |||
Thixotropy index | 5.8 | |||
Particle size | ≤15μm | |||
Copper mirror corrosion | Non-corrosive | |||
Performance after curing | ||||
Density(25℃,g/cm³) | 1.25 | ASTM D1875 | ||
Thermal expansion coefficient(um/m/℃) | <Tg 65 >Tg 180 | ASTM D 3386 | ||
Thermal Conductivity | 0.25 | ASTM D5470 | ||
Glass transition temperature(℃) | 110 | ASTM D 3418 | ||
Shear strength(MPa) | 15 | ASTM D638 | ||
Pull off strength(N) | 63 | SN59651 | ||
Permittivity(100KHz) | 3.8 | ASTM D 150 | ||
Dielectric Tangent(100KHz) | 0.014 | ASTM D 150 |