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SE8307- SMT glue SMT Printing adhesive SMT red adhesive Red glue
  • SE8307- SMT glue SMT Printing adhesive SMT red adhesive Red glue

SE8307- SMT glue SMT Printing adhesive SMT red adhesive Red glue

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Meorient Import & Export  Co.LTD
Meorient Import & Export Co.LTD
China - Hangzhou
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Hangzhou,Shanghai
Accepted Delivery Terms
Employees
5-10人
Accepted Payment Currency
USD,CNY
Average Lead Time
45 Day(s)
Certifications
Product Specifications
--
Product Description
Overview
Quick Details
CAS No.:
25085-99-8
Other Names:
red glue
MF:
Mixture
EINECS No.:
25085-99
Place of Origin:
Shandong, China
Classification:
Other Adhesives
Main Raw Material:
Epoxy
Usage:
Construction, Other
Brand Name:
Seayu
Model Number:
SE8307
Type:
Liquid Glue
Product name:
SMT adhesive SE8307
Application:
SMT
Color:
Red
Certificate:
MSDS
Packing:
200G/PC
Shelf life:
6 Months
Supply Ability
Supply Ability:
100000 Piece/Pieces per Month
Packaging & Delivery

SE8307 is one component epoxy adhesive and a kind of heat cured adhesive. It designed for stencil printing . High bonding strength, high humidity-intensity, excellent electrical performance and good storage stability

 

Typical Usage

Mainly used for the bonding of the mounted components on SMT.

 

Properties Uncured 

 

 Typical ValueRangeTest Standard
AppearanceRed cream  
Chemical TypeEpoxy Resin  
Viscosity (Pa.s) (Brookfield RV) Spindle 500-800GB/T 2794-1995
Thixotropic index5.6  
Density (g /cm3 )1.35           1.55-1.65       GB/T  13354-1992

Operate Time at Room Temperature

(day@25°C)                      

 14  

 

 

Curing Condition Recommended

90-120s at 120°C.

60-90s at 150°C

 

The product will obtain to higher bonding strength when higher curing temperature and longer cured time . the figure curve is the recommended curing temperature and heating rate,Underthe corresponding temperature ,components need the time when they achieve good bonding strength.

Users can set the curing furnace’s temperature parameters according to the solidified characteristic curve of the glue and the heat efficiency of the Reflow Ovens

 

Performance After Cured

(Cured for 30min@150°C)

 

Physical Property                            

 Typical ValueTest Sstandard
Hardness ( ShoreD )81  GB/T2411-1980
Shear Strength(MPa) 14.8   GB/T7124-1986
Tg(°C)(DSC)   98  ASTM E1545
Dielectric strength(KV/mm)    27.5 GB/T408.1-1999
Surface resistance (Ω)   3.4×1016                 GB/T1410-2006                  

 

Heat strength

(30min at 150°C)

Shear Strength(MPa)AL-AL

  

Direction For Use

The product should be recovered to room temperature before use, don't open the aluminum foil package before recovered to room temperature(the recovering time of 300ml packaging at least 2-4 hours).

The product should be used at 25°C ,

The glue viscosity will decline under the higher temperature, which influence printing effect; High humidity can increase the glue of moisture absorption which shorten the opening hours of the glue and influence the glue bonding strength. This product opening time is 48 hours at 25 °C,55% Rh.

Suggest to print at the speed of 20-150 mm/s; Drawknife pressure is 3-4 N/cm (Afer scraping, sheet should be clean, and avoid producing wire drawing); the deviating speed from the sheet is 0.1 3.0 mm/s.

Not cured adhesive which is stick on line wires can be erased with acetone or propylene alcohol ethers.

please seal and chill when not using up the glue.

 

Notice

Keep away from children. 

The workshop should be adequate ventilation.

Wash with soapy water if on skin.

Wash with a lot of soapy water and then go for doctor if in eyes.

For more information, please refer to MSDS.

 

Package

NO: 6414034 300ml

NO: 6414054 200ml

 

Storage

6 months sealed at 2-8°C.

 

 

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 SE8307- SMT glue SMT Printing adhesive SMT red adhesive Red glue from China supplier

 

 

 

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