PCB Production Capability | ||
Quotation Time | 1-2 layer in 24 hours, 4 layer in 48 hours, 6 layer in 72 hours | |
Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc | |
Material | FR-4, Hi-Tg FR-4, Lead free Materials | |
CEM-3, CEM-1, Aluminium | ||
High frequency Material (Rogers, Teflon, Taconic) | ||
Layer No. | 1 - 20 Layers | |
Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) | |
Board Thickness Tolerance | ±10% | |
Copper thickness | 0.5OZ - 4OZ | |
Impedance Control | ±10% | |
Warpage | 0.075%-1.5% | |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) | |
Min Trace Width (a) | 0.005"(0.125mm) | |
Min Space Width (b) | 0.005"(0.125mm) | |
Min Annular Ring | 0.005"(0.125mm) | |
SMD Pitch (a) | 0.012"(0.3mm) | |
Regesiter tolerance | 0.05mm | |
Min Solder Mask Dam (a) | 0.005"(0.125mm | |
Soldermask Clearance (b) | 0.005"(0.125mm) | |
Min SMT Pad spacing (c) | 0.004"(0.1mm) P | |
Solder Mask Thickness | Solder Mask Thickness | |
Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) | |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |