Guangxi Zhongke Alpha Technology Co., Ltd. 

Our company was established in 2019 with a registered capital of 16,242,067,000 yuan, located on the first floor of Building 2, China-ASEAN Digital Economy Industrial Park, No.8 Tianhe Road, Qingxiu District, Nanning. It was approved as a high-tech enterprise in 2023, and it is an IoT chip open source OS platform enterprise focusing on integrated circuit chip design+(advanced packaging of +(SiP chips and cloud programming technology of AIoT open OS). The company has obtained a number of chip packaging invention patents, and the AI algorithm won the second prize in the 19th IEEE International Conference on Computer Vision of ICCV 2023. This technology is mainly used in unmanned combat vehicles, robots, drones, autonomous driving, intelligent agriculture, VR AR and other fields. Based on self-developed chips, the company is used in unmanned aerial vehicles, gas meters, smart grids, intelligent monitoring of wind power, smart meters, photovoltaics, smart water meters, home smart terminal products and Xinchuang desktop computer terminal products. It is a new generation of high-tech companies integrating R&D, production and sales.At present, the production base of China-ASEAN Digital Economy Industrial Park covers an area of about 80,000m, and the production workshop is equipped with 14 high-speed production lines and core technical teams, which are high-tech enterprises that can provide design schemes and product development and production according to customers' needs. The company has 64 employees, of which 37.5% are technicians.Division I has strong technical strength, a high-quality R&D team and the ability of independent R&D, design and production. The company has obtained a number of patents, and took the lead in passing the ISO9001 quality management system certification in the industry. At present, our company has advanced production equipment and testing equipment at home and abroad, which ensures the high quality of products. In the future, the advanced packaging technology of SiP chips will be used to develop the packaging technology of international general Internet of Things chips, unmanned aerial vehicles and new generation display technology chips, focusing on the extended product line based on the third generation of "wide band gap" semiconductor materials. Focus on RF front-end devices, GaN-SiC silicon carbide, PHEMT, HEMT, SiC power devices, modular packaging of the fourth generation display technology of mini LED, and high-end software design of UAV, 5G industrial gateway and industrial Internet, and build a digital management platform with smart ecology, smart energy, smart city, SIP packaging and testing as the core, gradually improve the overall operation, data output and input, customer satisfaction and other functions of the platform, and continuously improve the company. In the future, our company will continue to increase investment in R&D, and constantly improve its technical strength and product competitiveness. In response to the national policy of "One Belt, One Road" and "Two Parks in Two Countries", we will open a factory in Pingxiang and strive to realize the strategic transformation of internationalization. We will expand domestic and foreign markets, enhance brand influence and strive to become a leading enterprise in the industry, which will be the main direction for the company to expand its future market. At the same time, we will actively explore new business areas and realize diversified development. We will continue to pay attention to industry trends and policy changes, and adjust our business strategies in time to ensure the stable development of the company.