Gap filler:
Features:
2 parts reactive silicone base
Dispensable
Using between componets and housing
Commercialized products:
N-SIL 8742: 2.5 W/m•K
N-SIL 8772: 3.3 W/m•K
N-SIL 8774: 4.0 W/m•K
N-SIL 8776: 6.0 W/m•K
Silicon Grease:
1 parts non-reactive silicone base
Dispensable and stencil-printable
Using between IGBT/MOSFET and heatsink
Commercialized products:
N-SIL 8630 BE: 3.0 W/m•K
N-SIL 8650-2: 5.5 W/m•K
N-SIL 8660: 6.0 W/m•K
N-SIL GP 8635: 3.5 W/m•K (post curing)
Silicon Gel:
1 part fully cured silicone base
Dispensable
Using between components and housing
N-SIL 8735Gel: 3.3 W/m•K
N-SIL 8745Gel: 4.5 W/ m•K