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underfill & edgebonding for chip
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Shenzhen MCOTI technologies Ltd,.
China - Shenzhen
Trading Company
Trade Capacity
Export Percentage
Nearest Port
Accepted Delivery Terms
Employees
11-50 people
Accepted Payment Currency
Average Lead Time
null Day(s)
Certifications
Product Specifications
Main Raw Material
Epoxy
Classification
Other Adhesives
Product Description
CollTech Edgebond materials has excellent reliability for large size BGA,
Minimize change product line and manufacturing process,
Low rework cost.
Assume below restrictions:
1. Assume 0.1% BGA failure rate,
2. Underfill rework successful rate is 60-70%, Edgebond rework successful rate is above 95%,
3. Per PCBA cost is 2000RMB,
4. Labour cost as 1000RMB/day,
5. Customer product shipments of per year is 25,000,000 pcs.
Currently process is UV EB process
Move to the Edgebond process with minimal changes to the product line.
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